Compounds
The following are some practical, commercial examples of adhesives and potting compounds currently offered.
Adhesives
A thermally conductive adhesive that performs well in many high frequency, power applications is silver-filled epoxy EP3HTSDA-1. This NASA-rated, low outgassing product, which has been used in vacuum systems, is both a thermally and electrically conductive adhesive system.
Particularly useful for die attach applications, an electrically insulating adhesive is Supreme 3HTND-2DA (see Figure S1). It is a one component epoxy with an extremely fast cure time at 125°C.
Figure S1 Supreme 3HTND-2DA is a fast curing, no mix, insulating epoxy system for die attach applications.
Figure S2 MB600S is a silver containing, aqueous based, sodium silicate system used as a coating in applications where the highest level of EMI shielding is required.
MB600S (see Figure S2) is a one part, sodium-silicate based material that can be used to coat devices in high frequency applications to achieve EMI shielding up to 18 GHz.
Figure S3 EP121AO is a thermally conductive, electrically insulating epoxy resin system for potting, encapsulation, coating and sealing.
EP21TCHT-1 is a widely used aluminum oxide filled insulating adhesive, even in cryogenic applications.
A graphite-filled epoxy system, EP75-1 can be used for bonding and sealing.
Supreme 18TC is a specially formulated one component epoxy with the largest particle size of just 10 to 15 µm. The small particle size enables very thin bond lines, increasing heat transfer and lowering thermal resistance.
Potting Compounds
EP121AO (see Figure S3) is a potting compound that has good flow properties and cures at an accelerated rate at temperatures around 150°C. It is also thermally conductive and has superior resistance to high temperatures.
EP30TC has a low viscosity and is good for high temperatures. It is a very stiff, high modulus material, which is key in many applications. Even though it is a two part chemistry, it can be pre-mixed and packaged in a specified amount in a frozen syringe, to speed the production process.
