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Industry News

Processing Equipment

April 1, 2000
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Processing Equipment

Laser Stencil
The LPKF StencilLaser/Polymer enables the production of polymer SMD stencils while drastically reducing print rejects due to better paste release, especially in fine pitch technology. The SMD stencils offer superior board contact during printing process as well as print speeds up to three times faster than metal stencils. The stencils also offer a longer lifespan and better memory effect of polymer stencils than metal stencils. In combination with the company’s TurboCut, the StencilLaser is well suited for micro-ball-grid-arrays, flip-chip, chip-scale packaging and wafer-bumping stencils.
LPKF Laser & Electronics AG, Garbsen, Germany +49 (0) 5131 7095 0.

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