EDI CON USA 2017, an event that brings together engineers working on high-frequency analog and high-speed digital designs, will take place at the Hynes Convention Center, September 11-13 in Boston, Mass. The event management team is pleased to announce this year’s conference chairs: Thomas Cameron, CTO for the Communications Business Unit at Analog Devices Inc. will serve as the chair for the high-frequency subject areas, and Istvan Novak, senior principal engineer at Oracle, will serve as the chair for the high-speed digital areas of the conference.
“In our second year of EDI CON USA, we are dedicated to growing the success of the conference, reaching more attendees and providing the types of quality educational and networking opportunities that are crucial to today’s design successes,” said Janine Love, event director.
With more than 30 years of experience in R&D technology for telecom networks, Thomas Cameron currently serves as the CTO for the Communications Business Unit at Analog Devices, Inc., where he is guiding and contributing to the R&D of radio technology for 5G systems in both cellular and microwave frequency bands. His design experience includes cellular base stations, microwave radios and cable systems. Prior to joining Analog Devices in 2006, he contributed to the development of a broad range of RF systems and technologies over his career at Bell Northern Research, Nortel, Sirenza Microdevices and WJ Communications. He holds a Ph.D. in EE from the Georgia Institute of Technology.
An author, speaker, and engineer, Istvan Novak has been working with high-speed digital, RF, analog circuit, and system design for more than 30 years. His work has included the signal integrity design of high-speed serial and parallel buses (at SUN Microsystems), design and characterization of power-distribution networks and packages, and the development of test and measurement methods for power distribution validations. Currently senior principal engineer at Oracle, he has 25 patents and is a Fellow of IEEE for his contributions to signal integrity and RF measurement and simulation methodologies. He is the lead author of the book Frequency-Domain Characterization of Power Distribution Networks and tutor for industry courses on power and signal integrity at University of Oxford and CEI-Europe. He holds a Ph.D. from the Hungarian Academy of Sciences.
A unique aspect of EDI CON USA is that it brings together engineers working in RF/microwave with those working in high-speed digital. EDI CON USA offers an opportunity to learn from other disciplines and transfer techniques and methods between applications. The exhibit floor will include booths from industry-leading companies working in both of these areas, as well as feature the SI ZONE, a specialized demo area for signal integrity, power integrity, and EMI/EMC products. The exhibit hall will also feature the popular Frequency Matters Theater, which offers speed training, presentations, and lectures for all pass holders during the two exhibition days.
This year, EDI CON USA will feature a 3-day conference, with extended tutorials and short courses on Monday, September 11, followed by technical papers, workshops, and panels on Tuesday and Wednesday. The conference focuses on actionable, educational sessions rather than product pitches and commercial presentations. According to one conference attendee from EDI CON USA 2016, “It is wonderful to have so many specialists in one place. You can get your problems solved.” The technical sessions will be organized around tracks focused on RF, microwave, and high-speed digital design (including signal integrity, power integrity, and EMC/EMI), modeling and measurement topics.
This year, EDI CON USA is the only RF/microwave industry conference and exhibition in the continental USA, and the largest high-speed technical conference on the US East Coast. Networking opportunities will abound on the exhibit floor, and attendees can enjoy a welcome reception and happy hour. So, save the date, and make plans to attend and participate in the second annual EDI CON USA.
More information, including how to exhibit for EDI CON USA 2017, is available at http://www.ediconusa.com. The Call for Abstracts is now open http://www.ediconusa.com/callforpapers.asp. For future planning, EDI CON USA 2018 will be held at the Santa Clara Convention Center (Santa Clara, CA) on October 17-19, 2018.
About EDI CON USA
EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, automotive, robotic, and medical industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, design contests, interactive sessions, speed trainings, networking opportunities, and educational talks that address all aspects of design, simulation, test, and verification.
About the Organizers
EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal, and the event planning division of their parent company, Horizon House. Microwave Journal, Signal Integrity Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China (April 25-27, 2017 in Shanghai, China). An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA) and the M2M Zone at CTIA Super Mobility Week/Mobile World Congress Americas.
The EDI CON technical program is developed in collaboration with leading international technology companies and experts in high-frequency and high-speed electronic design with experience ranging from modeling and design to component characterization, system integration, and verification.
Janine Love, Event Director
Carl Sheffres, Publisher
+44 207 596 8787