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Industry News

Packaging

September 1, 1999
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Packaging

Integrated Package
The UltraPack™ integrated package for high powered microwave amplifiers is capable of operating in three different modes, including impingement cooling mode, common horizontal cooling mode and natural convection mode. For the first time, pins are implanted directly into the microwave housing base, eliminating the heat sink’s base plate. Advantages over the traditional separate housing/heat sink design include reduced materials cost, a significant weight reduction and reduced height.
Cool Innovations Inc.,
Concord, Ontario, Canada
(905) 760-1992.

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