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Industry News

Materials

September 1, 1999
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Materials

Foam Powder
ECCOSTOCK“ FFP is a one-part, free-flowing syntactic foam powder for low loss, low dielectric constant and low thermal conductivity microwave applications. It infiltrates densely populated electronic packages, filling open spaces around delicate components. This epoxy-based material can be cured at temperatures as low as 100°C (212°F), or more quickly at higher temperatures, with minimum shrinkage and stress on delicate components. Cured material is easily removed for component repair or replacement. Available in a 2.5 oz. squeeze bottle, 5.0 oz. squeeze bottle or can, 1.25 lb. can or 6.25 lb. pail.
Emerson & Cuming Microwave Products,
Randolph, MA
(800) 650-5740 or (781) 961-9600.

Thin Core Copper-clad Laminate
The GML 1100 thin core copper-clad laminate features a dielectric thickness of 0.0035" or 0.0093" with 1/2 oz. or 1 oz. copper clad, is designed for high frequency, wireless thin core and multilayer applications and has a stable dielectric constant and low loss. The flexibility of the woven-glass-reinforced polyester system allows the laminate to be used for flex to install applications or to be wrapped around a mandrel as small as 0.5" in diameter. The laminate meets UL 94V-O flammability standards and processes and assembles like FR4.
GIL Technologies,
Collierville, TN
(800) 537-1306.

Silver Conductor Paste
The model KQ610 silver conductor paste is designed for producing ultra-high density interconnections using a combination of screen printing and photoengraving. The material features excellent bondability and adhesion and creates extremely dense fired films with very smooth fired finishes that support the production of conductor geometries of 50 mm (2 mils) or better. The paste has low dielectric loss of 0.01 percent and low dielectric constant of 3.9 and offers microwave performance to at least 80 GHz.
Heraeus Inc., Cermalloy Division,
West Conshohocken, PA
(610) 825-6050.

Woven-glass PTFE Laminates
The ULTRALAM“ 1000 series woven-glass-reinforced PTFE laminates are designed for common antenna and amplifier applications, including LAN and cellular base systems. The materials match the dielectric constant and loss tangent characteristics of other woven-glass PTFE laminates. Glass fibers oriented in the X/Y plane improve dimensional stability, lower thermal expansion and make the laminates ideal for applications where registration is critical. Other features include stable electrical properties vs. frequency good chemical resistance and low loss. Sizes: 4" x 10" (for large panel antennas), 12" x 18" and 24" x 36". Standard thicknesses include 0.020", 0.031" and 0.062" for dielectric constants of 2.171, 2.50 and 3.0.
Rogers Corp., Microwave Materials Division,
Chandler, AZ
(480) 961-1382.

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