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Industry News

Design Equations for Maximum Power Transfer in Back-to-back Stacked Microstrips

The design of noncontacting RF interconnections using a slot in the common ground plane for application in mulitlayered structures

September 1, 1999
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Technical Note

Design Equations for Maximum Power Transfer in Back-to-back Stacked Microstrips

K. Rambabu, M. Ramesh and A.T. Kalghatgi

Please click here to view the pdf file of the Technical Note

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