EDI CON USA 2016, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, hosted a successful inaugural event in the U.S. on September 20-22 in Boston, Mass.

"We are very pleased with our first EDI CON USA, which exceeded our expectations in number of exhibitors and submitted abstracts for the conference program. We appreciate the support of the EDI CON USA exhibitors, received very positive feedback from conference attendees, and look forward to building on these strengths for next year," said Ivar Bazzy, President of Horizon House, the conference's organizer. "Our attendance exceeded that of our first event in China, which has experienced double digit growth year on year. We expect the same type of trajectory for our U.S. event." EDI CON China will hold its fifth event April 25-27, 2017, in Shanghai, China.

The technical sessions were organized around tracks focused on RF, microwave, and high-speed digital design (including signal integrity, power integrity, and EMC/EMI), modeling and measurement topics. The event also saw the launch of a new publication, The Signal Integrity Journal, which serves the signal integrity, power integrity, and EMC/EMI fields.

Next year's event, EDI CON USA 2017, will be held at the Hynes Convention Center (Boston, MA) on September 11-13, 2017. EDI CON USA 2018 will be held at the Santa Clara Convention Center on October 17-19, 2018. More information, including how to exhibit for EDI CON USA 2017, is available at http://www.ediconusa.com.

About EDI CON USA

EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries.

Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, design contests, interactive sessions, speed trainings, networking opportunities, and educational talks that will address all aspects of design, simulation, test, and verification.

About the Organizers

EDI CON USA is organized by Microwave Journal and the event planning division of its parent company, Horizon House. Microwave Journal and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China. An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA) and the M2M Zone at CTIA Super Mobility Week/Mobile World Congress Americas. The EDI CON program is developed in collaboration with leading international technology companies and experts in high-frequency and high-speed electronic design with experience ranging from modeling and design to component characterization, system integration, and verification.

EVENT CONTACT:

Janine Love, Event Director

+1-857-350-2216

jlove@horizonhouse.com

Twitter: @tb_janine

 

SALES CONTACT:

Carl Sheffres, Publisher

+1-781-619-1949

csheffres@mwjournal.com

 

EDITORIAL CONTACTS:

North America:
Pat Hindle
+1 781 619 1946
PHindle@MWJournal.com
Twitter: @pathindle

 

International:
Richard Mumford
+44 207 596 8787
RMumford@MWJournal.com