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Industry News

HARDWARE

August 1, 1999
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HARDWARE

Two-part EMI Shield
The BOLDT SHIELD II™ is a standard off-the-shelf, two-part electromagnetic interference shield packaged in standard EIA410 tape-and-reel formats for automated circuit board-level installation. Its unique design (with removable lid) provides easy access to inspect or repair important electronic components without having to detach the surface-mount technology shield. Available in many JEDEC sizes, including 52-pin quad flat pack (TQFP), 256-position ball-grid array (BGA) and 84-pin plastic leadless chip carrier (PLCC) packages, the shield combines high shielding performance and reliability with added flexibility for prototype adjustment.
Boldt Metronics,a business unit of BMI,
Palatine, IL
(847) 934-4700.

High Fin Density Heat Sinks
The HT series heat sinks provide high cooling power for various devices and are suitable for applications with high volume air flow. The bonded fin heat sink features ~ 13 fins/inch. Size: 3" x 3" x 2" up to 8" x 10" x 4". Price: from $10 each (500). The machined heat sink features ~ 10 fins/inch. Size: 1.0" x 1.0" x 0.5" up to 3" x 7" x 2". Price: from $5 each (500) with gang-saw technique.
ACK Technology Inc.,
Buena Park, CA
(714) 739-5797.

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