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Industry News

MATERIALS

April 1, 1999
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MATERIALS

Thin-Core Copper-clad Laminate
The GML 1100 series thin-core laminate features two core constructions of less than 0.010" and is targeted for multilayer and thin-core wireless applications. The material features a Tg of greater than 150°C and coefficients of thermal expansion comparable to FR-4.
GIL Technologies, a division of The Alpha Corp.,
Collierville, TN
(901) 853-5070.

Thermal-management Adhesive
The THERMAXX™ 2600K series thermal-management adhesive designed by Ablestik Laboratories serves as a lead-free alternative to solder in low stress surface-mount applications. The adhesive can be used for surface-mount bonding where solder performance is unacceptable. The unit features thermal conductivity that is eight- to 10-times higher than existing conductive epoxy adhesives. With a thermal conductivity measured at 20 W/mK, the material approaches the conductivity of eutectic products without any lead and with the ability to withstand higher temperatures than solder. The adhesive is suitable for use in automotive applications where components must withstand temperatures from -55 ° to +175°C.
Emerson & Cuming Specialty Polymers,
Billerica, MA
(800) 832-4929.

Silver Conductive Via Plugging Ink
The 1210 series silver conductive via plugging ink provides low cost blind-and buried vias on double-sided and multilayer PCBs while enhancing the boards' reliability. The 100 percent solids ink has virtually no shrinkage on curing and results in boards that are fully planar, more reliable and less expensive to produce. The ink can be used either with or without through-hole plating. Specifications include a glass transition temperature of 120°C, coefficient of temperature expansion of 40 ppm/°C from -50° to +120°C and a shelf life of 30 days at room temperature and three months at -10°C.
Methode Development Co., a subsidiary of Methode Electronics Inc.,
Chicago, IL
(800) 323-6858.

Flexible Microwave Resonant Absorber Materials
The RS-4000-SF-RA series silicone rubber materials comprise thin magnetic resonant absorbers based on flexible silicon rubber materials. Available for use in frequency ranges from 2 to 18 GHz, these nonflammable materials are suitable for applications with service temperatures up to 450°C. The materials offer 20 dB attenuation at the design frequency. Depending on performance, thickness ranges from 0.105" +/-0.005" down to 0.042" +/-0.005". The RS-4000-UF-RA series urethane elastomer materials comprise thin magnetic resonant absorbers based on flexible urethane elastomer material. Also available for use in frequency ranges from 2 to 18 GHz, these self-extinguishing materials are suitable for applications with service temperatures up to 300°F. These materials also offer 20 dB attenuation at the design frequency. Depending on performance, thickness ranges from 0.190" +/-0.005" down to 0.042" +/-0.005".
Resin Systems Corp.,
Amherst, NH
(603) 673-1234.

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