These TO-25X type packages are designed for power controllers and power rectifiers with 75 percent less resistance than standard glass-to-metal packages. The units feature a ceramic eyelet brazed to low resistance copper alloy pins and copper alloy on the ground plane. All components are attached with a high temperature braze to ensure a reliable, hermetic joint and meet MIL-883 and MIL-PRF-38534 requirements. The packages are suitable for applications where the voltage drop across the package must be low or high power/current is required. Packages are available in TO-254, TO-258 and TO-259 outlines. Split or solid die attach and ground pin options also are available.
Kyocera America Inc., Metallized Division,
San Diego, CA