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EMI Gasket Materials
The Cho-Form" series form-in-place EMI gasket materials are developed for automated dispensing systems. The Cho-Form 3.0 series material is a silver-plated, copper-filled silicon with a low 85°C cure temperature; the Cho-Form 4.0 series material is a nickel-graphite-filled silicone formulated to reduce galvanic activity between a housing and its EMI gasket; and the Cho-Form 5.0 series material is a Ag-/Cu-filled silicone that cures at room temperature. All of the gasket materials provide greater than 75 dB of EMI shielding performance from 200 MHz to 10 GHz. The gaskets have good adhesion to a broad variety of metals, alloys, plating and coatings, which eliminates the need for space-consuming mechanical retention systems. The materials’ technology allows dispensing of gaskets onto flanges as narrow as 0.030" with location accuracy within 0.001", resulting in a space saving of up to 60 percent in package designs compared to other EMI gasket methods.
Chomerics, a division of Parker Hannifin Corp.,
The C-RAM series RF problem solver kit designed for engineering evaluation contains nine different C-RAM RF materials that can be used in solving RF signal leakage, device compatibility or cavity resonance problems. Provided in the kit are lossy carbon-loaded foam and magnetic silicon rubber-type absorbers for use in the 100 MHz to 40 GHz range. The C-RAM materials can be cut to size, applied to a lid and used readily for engineering evaluation. Each piece of material has pressure-sensitive adhesive on the back for ease of assembly.
Cuming Microwave Corp.,
(800) 432-6464 or (508) 580-2660.
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