The third annual Electronic Design Innovation Conference (EDI CON) China takes place April 14-16 at the China National Convention Center (CNCC) located in the Olympic Village in Beijing. The conference and exhibition has expanded in its first two years and outgrew its previous venue. Like the Olympics, this event draws some of the best “industry athletes” or experts from around the world. They come each year to share and exchange information on the latest developments and advances in our industry.
The conference kicks off at 10:00 on April 14 on the fourth floor of the CNCC with some exciting paper sessions including a full track on amplifier design that includes the latest on envelope tracking and DPD design. There are five parallel tracks including one on high frequency PCB and connector design with presentations from leading substrate material and connector companies from around the world. Another track includes high frequency and high speed design techniques covering various measurement & modeling subjects and mmWave topics. The system level measurement and modeling track features topics on the latest in OTA measurements, Wi-Fi and oscilloscope technology. The systems engineering track on Tuesday covers topics such as MIMO antennas, base stations and measurement chambers. The afternoon workshops build on these topics by offering tutorials from company experts involved in these subject areas.
At 15:30 on Tuesday, the keynote plenary talks commence in the auditorium on the fourth floor. EDI CON honorary chairman, Prof. Dr. Junde Song from Beijing University of Posts and Telecommunications will discuss how the “Construction of Smart Cities and Communities” is driving rapid development of ICT Industry in China. Dr. Song is leading many of the Smart Cities projects around China and is an expert in this area of research. His talk will be followed by Wai Chen from China Mobile Research Institute, discussing the latest developments in the Internet of Things (IoT). Hongbing Ma of China Unicom will then talk about 5G co-existing opportunities and challenges for future communications systems. Jian Li Wang, CTO of RF Products from ZTE will discuss the latest developments in 5G and massive MIMO. Our three major sponsors, Keysight Technologies, Rohde & Schwarz and National Instruments will also discuss their latest product developments and capabilities during the plenary talks.
I am especially excited about the addition of a full day 5G Forum on advanced communications taking place on Wednesday, April 15. The 5G Forum starts with a keynote speech by Dr. Zhengang Pan, principal scientist at China Mobile Research Institute about their vision of 5G and IoT followed by the latest developments from Ericsson. Next will be a panel session with various 5G experts discussing questions from the audience about 5G. The rest of the day includes eight sessions and two workshops covering topics such as massive MIMO, HetNets, phased array transceivers, timing and synchronization, testing challenges, SDR, new modulation schemes and mmWave technologies. This should be a very popular addition to the conference.
The second day also features some interesting tracks including an IoT design track with sessions about low power design, antenna tuning and switching. Another track features several talks on EMI modeling/testing and high speed design techniques. Radar design, test and simulation is the focus of another full day track for system level measurements and modeling plus the systems engineering track covers various topics in testing and designing high frequency and high speed digital systems. The paper session tracks will again be followed by workshops and a special GaN panel with industry experts discussing the status and future of GaN technology in a round table format.
The final day features tracks on microwave component design from VCOs to MMICs to PAs based on
LDMOS and GaN technology. There is a measurements and modeling track covering device modeling topics and basic microwave measurement techniques. Another track features various topics on EMC/EMI and high speed measurements and modeling with the systems engineering track covering some high power subsystems and unique communications systems. These are followed by more workshops given by industry experts to close out the conference.
The third annual EDI CON China promises to be bigger and better than ever with a variety of high frequency, high speed and EMC/EMI topics planned over the three day event. EDI CON China 2015 has more than 95 paper sessions and 35 workshops so there is something for everyone. Please join us in Beijing this spring!