Rogers Corp., will be promoting its industry-leading printed circuit board (PCB) materials at the IPC APEX EXPO, February 24-26, 2015 at the San Diego Conference Center in San Diego, California.
With the recent acquisition of Arlon, Rogers Corp. now has expanded material options for customers in the telecommunications infrastructure and aerospace & defense sectors. Attendees can visit Rogers’ booth #1701 and Arlon’s booth #2306 to learn more about which PCB materials will best meet their needs.
For those seeking to learn more about electronic material characteristics, Rogers Corp.'s senior market development engineer, John Coonrod, will be contributing to two panel discussions. The first, “The Effects of PCB Fabrication on High Frequency Electrical Performance,” is part of a High Speed/High Frequency technical session scheduled for 10:30 AM on Wednesday, February 25. It will explore the impact of different circuit materials and their fabrication processes for a growing number of high-frequency electronic applications, from cellular telephones to radar systems in cars. The second, “Thermal Management Advantages of Thermally and Electrically Conductive Adhesives,” is scheduled for Thursday, February 26, at 9:00 AM, and will investigate the growing importance of various adhesive materials as used with PCBs, notably with multilayer circuit boards. John holds a bachelor’s degree in Electrical Engineering from Arizona State University and brings over 25 years involvement in the PCB industry, working with flexible and rigid circuit materials for a wide range of applications.
For more information, visit www.rogerscorp.com.