Remtec Inc., a leading manufacturer of substrates and packages using PCTF® (plated copper on thick and thin film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities includesolid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
Solder mask options include liquid photo image-able LPI for higher resolution patterns, high operating temperature (400°C) solder mask and elevated reflectivity mask for high luminance requirements typical for LED applications. Finally, Remtec complements DBC substrate fabrication with assembly capabilities including flying leads and pin/lug attachment onto metallized ceramics using CuSIL (copper-silver alloy) brazing and AuSn (gold tin) soldering.
Remtec offers a wide variety of DBC products on alumina and aluminum nitride with many versatile copper finish options including selective gold tin to ensure excellent solderability, wire bondability and product reliability. The use of palladium plating enables economical assembly techniques including SMT soldering, low and high temperature die attach, aluminum wire, gold wire and ribbon bonding.
Now designers can utilize front-to-back connections, wire and terminal connections, flow-controlling solder mask and lead, pin and lug attachments on DBC substrates. Added DBC capabilities allow Remtec to address more applications in defense, aerospace, industrial power, medical instrumentation and green technologies.
Remtec, a RoHS compliant, ISO 9001:2008 registered and ITAR compliant company, operates a manufacturing facility totaling 33,000 sq. ft. in Norwood, MA. Remtec provides custom and semi-custom packaging solutions for RF/MW products, DC power electronics, optoelectronics and other high density and power circuitry in commercial, industrial and military industries.
For more information, please visit www.Remtec.com or stop by Booth 331 at APEC 2015, March 16-17 2015.