- Buyers Guide
5G and IoT Supplement
Thick-film Gold Conductors
The model QG150 high density, thick-film gold conductor composition is designed for interconnect applications that require ultra-fine-line resolution or superior performance at high frequency. The material features high conductivity, dense fired films, good edge definition to provide low loss at frequencies above 20 GHz, and is capable of being etched to resolve features smaller than 25 mm. In addition, the material is compatible with a wide range of ceramic substrates and thick-film multilayer dielectrics. Patterned on 96 percent alumina substrates, the material has high frequency performance equivalent to that of think film on 99 percent alumina substrates.
DuPont Microcircuit Materials,
EMI Caulking Compounds
The ECCOSHIELD" electromagnetic interference (EMI) caulking compounds are easy-to-use, one-part nonhardening systems with high electrical conductivity. The compounds remain flexible even after curing to provide good shielding integrity for treated seams or joints on platforms that incur stress due to vibration or joint flexing. The ECCOSHIELD"VY compounds offer volume resistivity of 0.001 W-cm and a density of 4.9 g/cc. Seams caulked with this product achieve insertion losses of 100 dB. Typical coverage for a bead of 1/8" diameter is 50 ft/lb. The ECCOSHIELD"VY 81 series has volume resistivity of 0.01 W-cm and density of 1.8 g/cc. Seams caulked with this compound achieve insertion losses of 80 to 90 dB. Typical coverage for a 1/8" diameter bead is 50 ft/lb. ECCOSHIELD"VY 81 has a coarser texture than ECCOSHIELD"VY and costs less per unit volume. Both products have a shelf life of six months and can be applied by syringe, caulking tube, spatula or putty knife. Delivery: five days.
Emerson and Cuming Microwave Products Inc.,
(800) 650-5740 or (781) 961-9600.
Copper-coated, Self-adhesive FPC Film
The type C351 ferrite polymer composite (FPC) film is designed for high temperature applications up to 200°C and is UL 94-VO-listed. The film is also available with copper coatings of 35 to 100 mm and in various thicknesses from 0.2 to 0.4 mm. FPC material is a homogeneous mixture of ferrite powder and plastic that can be processed into thin, flexible film. The film is designed for electromagnetic compatibility applications, such as shielding coils against metals or absorb interference at frequencies of 500 MHz and higher.
Siemens Matsushita Components,
+49 89 636-28083.
Through-hole Plating System
The Quick Plate series one-bath, through-hole plating system is designed for circuit board materials and is part of the company’s Quick CircuitTM line of products. The system can electrically through-plate holes as small as 0.012" in approximately one hour. It operates on standard materials such as FR-4, as well as polytetrafluoroethylene and alumina substrate materials such as Duriod, Arlon and TMM. Price: $8995.
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