TJ Green Associates will be offering a one-day LTCC Packaging Technology course at the NATEL Ceramic Plant in Carlsbad, Calif. on October 9, 2014.
Low Temperature Cofired Ceramic LTCC substrates, and integration into LTCC Multi-Chip Modules (MCM) and LTCC microwave modules all require a unique set of materials and processes necessary to achieve reliable operations in extreme military and commercial environments. This one-day course examines the major aspects of LTCC and microwave packaging from a practical perspective. The instructors share valuable lessons learned from years of experience. Design issues, material trade-offs, process selection are all covered in detail with the goal of imparting useful information to the students.
This course is intended as an intermediate level course for process engineers, designers, quality engineers, and managers responsible for design and manufacture of microwave hybrids. Full Course Outline & Registration Info
This LTCC Packaging Technology class will be taught along with seasoned co-instructor, Tom Terlizzi, Agile Microwave Technology.
"We're very excited about the upcoming LTCC course, which occurs right before the October 13 IMAPS San Diego Symposium" said Mr. Green. "Our LTCC Packaging Technology course will help companies develop new Low Temperature Cofired Ceramic LTCC substrates and packages for integration into MCMs, RF/MMIC and microwave modules for use in extreme military, space, and commercial environments."
Included in the course is a comprehensive student workbook plus continental breakfast and lunch.
Class size is limited to allow for maximum student interaction. Register now!
Mr. Green concluded, "Companies who invest in our training gain immediate access to specialized knowledge from industry experts that you just won't find anywhere else. We're expecting heavier-than-usual demand this year and our limited number of openings will fill up quickly."