- Buyers Guide
Horizon House Publications and Microwave Journal China announced the participation of Rogers Corporation, Arlon, Taconic, Isola and Park Electrochemical as presenters/exhibitors at next year’s EDI CON event in Beijing, China to be held April 14 – 16. Experts from these leading manufacturers will offer EDI CON attendees an opportunity to discuss application specific requirements, design techniques and electrical/mechanical/thermal properties of high-performance materials used in PCB-based RF/microwave and high-speed digital electronic design.
Printed circuit boards used in wireless applications require special considerations to avoid excess signal loss and unwanted electromagnetic coupling between signal lines and components. As radio performance becomes more stringent, manufacturers are developing high-performance substrate materials to address the needs of wireless device manufacturers for applications that include advanced commercial and military electronics such as avionics, semiconductor testing, heat sink bonding, high density interconnect (HDI) and PCBs used in mobile communication products. The technical conference and exhibition at EDI CON examines many of these challenges for high-frequency PCB-based circuit design.
Among the material manufacturers, Rogers Corp. will be expanding their participation in 2015 as a silver sponsor hosting a special PCB workshop (to be announced). Rogers is a well-recognized name in high performance specialty electronic materials. The company’s Advanced Circuit Materials Division has an extensive selection of high frequency laminates for almost all types of applications including materials that are very low loss, or optimized for temperature stability or physical rigidity while others are suited for low cost commercial applications. Experts at EDI CON will help designers make sense of which product to use for a given application.
Also presenting a talk in the technical conference, Arlon Electronic Substrates specializes in thermoset resin technology including polyimide, high Tg multifunctional epoxy, and low loss thermoset laminate and prepreg systems. These resin systems are available on a variety of substrates including woven glass and non-woven aramid. The company’s Microwave Materials division specializes in fluoropolymers (i.e. PTFE), ceramic-filled fluoropolymers, and low loss ceramic hydrocarbon thermoset laminates for frequency-dependent circuit applications such as base station antennas, phased array radars, power amplifier boards, communications systems, and various other antenna applications.
About EDI CON
EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The technical program and exhibition includes the leading international RFIC, component and material manufacturers, semiconductor foundries, EDA software and test equipment/solution providers. This year’s conference features the most recent trends in high-frequency electronics and wireless communication technology, addressing all aspects of design, simulation and test verification through an understanding of system requirements for wireless communication networks such as small cell infrastructure, SATCOM and microwave backhaul.
About Horizon House
Horizon House is an experienced and well-established organizer of targeted events, including European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA), and several major microwave related conferences/exhibitions such as the RF/Microwave, M2M and Microwave Backhaul Zones at CTIA.
Microwave Journal China, a Horizon House Publication and sister magazine of Microwave Journal, will actively promote and publicize EDI CON 2015 to local engineers, technology companies and academia, while also providing input from, and a link to, the wider high speed, high frequency, RF and microwave community.
For information on the conference program, ongoing updates and major announcements and to register for EDI CON 2015 visit: