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Agilent Technologies Inc. announced several innovations for the 2014 release of its industry-leading suite of device modeling and characterization software tools. The suite comprises Agilent EEsof EDA’s Integrated Circuits Characterization and Analysis Program (IC-CAP), Model Builder Program (MBP), and Model Quality Assurance (MQA).
“Over the past few years, we’ve steadily expanded our device modeling platform through internal development and acquisition of key technologies,” said Brian Chen, Agilent’s device modeling planning manager. “This marks the first release of our entire portfolio and represents a significant advancement toward our vision of being a partner that uniquely delivers a complete end-to-end, measurement-to-modeling solution.”
The new software release features three advanced device modeling packages for Agilent’s DynaFET, BSIM6, and BSIM-CMG models. BSIM6 is the industry-standard model for bulk MOSFETs, offering important improvements for analog/RF applications over its predecessor, BSIM4. BSIM-CMG is the industry-standard model for sub-20 nm 3-D FinFET technologies. Modeling solutions for both BSIM6 and BSIM-CMG in the 2014 release are designed to help the semiconductor industry understand and use these new technologies.
The DynaFET modeling package is based on internally developed technology and is an integral part of Agilent’s GaN HEMT characterization, modeling and simulation solution. The GaN HEMT modeling package provides a GUI-based turnkey solution for DynaFET model generation.
Using artificial neural networks for charge and current formulations, and incorporating trapping/de-trapping and self-heating effects, the time-domain DynaFET model is capable of fitting accurately to DC, linear and large-signal measurement data—all simultaneously. This allows a single model file to be used for the design of different applications under various bias conditions, all with accurate simulation results.
The 2014 device modeling and characterization software release also provides a number of new and enhanced features designed to noticeably improve productivity across the end-to-end work flow of device characterization, model generation and model validation. These enhancements include:
Agilent’s 2014 device modeling and characterization software release will be available in July. More information on the 2014 release of IC-CAP, MBD and MQA software is available at www.agilent.com/find/eesof-iccap, www.agilent.com/find/eesof-mbpand www.agilent.com/find/eesof-mqa, respectively. Images of the software are available at www.agilent.com/find/DeviceModeling_2014_images.
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