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Industry News / Materials/Packages

New web site strengthens Remtec's position as leader in providing ceramic packaging solutions

June 17, 2014
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Remtec Inc., the leading manufacturer of substrates and packages using Plated Copper On Thick Film (PCTF®) metallization, has completed a new, comprehensive web site www.remtec.com that strengthens Remtec's position as the leader in providing ceramic solutions for DC power electronics, optoelectronics and RF/MW applications. The new site  provides a simple graphic overview of  company  capabilities and products starting from its core PCTF® technology products  such as leadless ceramic SMT chip carriers, substrates and packages (hermetic and non-hermetic),  laser and photodiode submounts and  LED submounts. It also describes other Remtec added-value ceramic technologies:  low cost AgENIG® substrates, high density thick films and direct bond copper.   Any of  these  categories can be quickly accessed and provide the engineer with examples, photos and drawings as well as  complete technical data in a wide range of commercial, industrial and military industries.

For those circuit designers and engineers desiring more detailed support, there is quick access to general design rules, DBC design rules, process capabilities and technical articles.  For prospects and customers interested in manufacturing capabilities, the simple link provides a complete view of operations including state-of-the-art automated thick film processing, electroplating and autocatalytic plating, a class 100,000 clean room and the latest quality control equipment.  Navigation throughout the site is intuitive, the data is fast loading and presented clearly, and the opportunity for additional information and support is readily available. 

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