Indium Corporation's vice president of technology, Dr. Ning-Cheng Lee, will share his expertise at the International Union of Materials Research Societies – International Conference on Electronic Materials (IUMRS-ICEM) from June 10-14 at Taipei World Trade Center Nangang Exhibition Hall in Taipei, Taiwan.
Lee’s session, "Development of High Temperature Lead-Free Solder Materials", will discuss the drivers of change for power semiconductor assembly materials and the development of Indium Corporation’s BiAgX® as a drop-in replacement for high-Pb solder paste, as well as composite solder preform TLP solutions.
Dr. Lee has extensive experience in the development of solder pastes, fluxes, high-temperature polymers, microelectronics encapsulants, underfills, and adhesives for electronics assembly. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high-performance and low-cost of ownership. Dr. Lee is an SMTA Member of Distinction and a member of the SMTAI planning committee.
IUMRS-ICEM 2014 will bring together scientists and industries from across the world with the objective of providing a forum for gaining academic insights. The conference is comprised of six groups consisting of 26 technical symposia that will focus on electronics materials and related technologies. For more information, visit www.iumrs-icem2014.tw.