Indium Corporation’s Derrick Herron, technical support engineer, will serve as an expert presenter at ZESTRON’s assembly, cleaning, and reliability hands-on Workshop on June 10 in Franklin, Mass.
Herron will present Various Ways to Minimize Voiding Under Bottom Terminated Components. This discussion will include the common challenge in SMT of voiding under bottom-terminated packages. Voids in the solder joints can lead to hot spots and component damage. Herron will outline possible ways to combat this challenge, including changes in stencil design, changes in board pad design, or the use of solder preforms. For more information on this workshop, visit www.zestron.com.
Herron has worked with the world renowned Dr. Ning-Cheng Lee in Indium Corporation's research and development laboratory for more than five years. In addition, his work with Indium Corporation’s Dr. Yan Liu focused on developments in solder paste and flux technologies. He has co-authored several research papers on the topic of QFN voiding. Herron has a bachelor’s degree in chemistry from Oklahoma State University, Stillwater, Oklahoma. He earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College and was certified in IPC-A-600 and IPC-A-610-D.