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High Speed Interconnects (HSI), a full service cable extrusion and coaxial assembly manufacturer, announces increasing capabilities to solve custom, small form factor interconnect challenges.
As engineers face the competing pressures of less board-space combined with the need for transfer speeds at microwave spectrum data rates, HSI has been ramping up their R&D efforts to provide the answer to both pressures. Both the coaxial construction, which includes the proprietary dielectric of HSI’s micro coaxial solutions are extruded in-house to tight specifications, providing exacting performance up to 10 GHz, with micro-coaxial connector terminations down to 0.3 mm pitch, and fine wire, direct-to-board terminations down to 0.175 mm. The fine wire direct-to-board method provides unrivalled footprint dimensions and can be ruggedized with HSI’s proprietary strain relief process. Custom wired-to-board does not infer higher cost, in fact it can be lower than using exotic, hard to find, small footprint connectors.
HSI's certifications are extensive, and include AS9100 revision C, ISO9001, IPC 610/620, ITAR Registration, and multiple MIL Spec compliances. HSI is factory-certified in North America to properly terminate to Hirose, IPEX, and JAE micro coaxial connectors.
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