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Industry News / Materials/Packages

Indium Corp. VP of technology to present at ECTC

May 16, 2014
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Indium Corp.'s Dr. Ning-Cheng Lee, vice president of technology, will teach a professional development course at the Electronic Components and Technology Conference (ECTC) May 27-30 in Lake Buena Vista, Florida. 

Lee’s course, Lead-Free Solder Joint Reliability – Materials Consideration, will cover materials considerations required for achieving high-reliability lead-free solder joints. This course will provide a greater understanding of how various factors contribute to the failure modes, and how to select proper alloys and surface finishes for achieving high-reliability.

For more information or to register, visit www.ectc.net.  

Dr. Lee has extensive experience in the development of solder pastes, fluxes, high-temperature polymers, microelectronics encapsulants, underfills, and adhesives for electronics assembly. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high-performance and low-cost of ownership. Dr. Lee is an SMTA Member of Distinction and a member of the SMTAI planning committee.

ECTC is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society if the IEEE. 

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