Agilent Technologies acquires electrothermal analysis technology from Gradient Design Automation
Agilent Technologies Inc. announced its acquisition of electrothermal analysis technology from Gradient Design Automation, the maker of HeatWave electrothermal analysis software. Agilent EEsof EDA now has sole ownership of Gradient’s core technology and will serve customers of both the integrated Advanced Design System software solution and Gradient’s HeatWave solution.
The electrothermal analysis technology allows designers to identify and correct thermal problems during integrated circuit development.
“Thermal management is one of the toughest challenges facing modern IC designers,” said Todd Cutler, general manager of Agilent EEsof EDA. “That’s why our integrated ADS electrothermal solution was so well received by customers following its introduction and has already been adopted by several major RFIC/MMIC vendors. Today’s announcement further reinforces our commitment to continue working to solve this difficult challenge for our customers.”
The acquisition stems from a cooperative agreement between Agilent and Gradient that began in 2012, when a version of Gradient’s technology was integrated into the ADS software as part of a comprehensive multitechnology solution for RFIC and MMIC development. In 2013, Agilent announced an expanded business relationship with Gradient that included increased financial commitment on Agilent’s part in exchange for increased access to Gradient’s electrothermal analysis technology.
“The growth of Gradient’s business is proof that the unique software technology we created is highly effective at solving an important industry problem,” said Ed Cheng, president of Gradient. “We are quite pleased and excited that Agilent, established market leader in the EDA industry, will now carry the technology forward and work to further expand its market reach.”
Agilent’s newly acquired electrothermal analysis technology will be demonstrated, along with 20 of the company’s newest design and measurement solutions, at IEEE MTT-S International Microwave Symposium 2014 (Booth 1133), June 1-6, in Tampa, Fla. Agilent Partners, co-located around the Agilent booth, will demonstrate solutions for modeling and device characterization; semiconductor foundries; IC, wafer, and PCB design, test, and prototyping; antenna measurement systems and test chambers; and custom systems. In addition, Agilent’s Dr. Robert Shimon, an R&D manager in Agilent’s High Frequency Technology Center, will also provide his insights on “How Digital Markets are Driving Microwave Technology” at the MicroApps Theater on Tuesday, June 3, 10:05–10:45 a.m.