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Derrick Herron, technical support engineer, will give a poster presentation called Methods of Choosing a Solder Paste and Overcoming Common Challenges. His presentation will discuss what to consider when choosing a solder paste and how to prevent some of the common defects that may arise during manufacturing, such as head-in-pillow, graping, and QFN voiding.
Maria Durham, product specialist for semiconductor and advanced assembly materials, will serve as the session co-chair for the Technologies and Methods for 2.5D and 3D Packaging. She will be responsible for introducing speakers and facilitating the discussion.
Herron has worked with the world renowned Dr. Ning-Cheng Lee in Indium Corporation's research and development laboratory for more than five years. In addition, his work as a technician for Dr. Yan Liu focused on developments in solder paste and flux technologies. He has co-authored several research papers on the topic of QFN voiding. Herron has a bachelor’s degree in chemistry from Oklahoma State University in Stillwater, Oklahoma. He earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College and was certified in IPC-A-600 and IPC-A-610-D.
Durham serves as a technical liaison between Indium Corporation’s customers and internal departments, such as sales, technical support, research and development, and operations, to ensure the best quality and selection of products. Durham is a member of the International Microelectronics Assembly and Packaging Society and earned her bachelor’s degree in physics and applied mathematics from Clarkson University in Potsdam, N.Y. While she was at Clarkson, she worked as a McNair Scholar performing research in electro-chemical deposition.
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