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Industry News

AWR presents and exhibits at EDI CON 2014

April 7, 2014
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AWR will be presenting and demonstrating its soon-to-be released V11 NI AWR Design Environment™ at EDI CON 2014 in Beijing, China starting April 8 and running through April 10, 2014.  V11, the first major software release in 2014, includes new features, functionality and enhancements to Microwave Office®/Analog Office® circuit design software, Visual System Simulator™ (VSS) system design software, AXIEM® 3D planar electromagnetic (EM) software, and Analyst™ 3D finite element method (FEM) EM software. Demonstrations within booth #301 will showcase V11 new features and functionality and in particular the new user-customizable PCell capability and antenna measurements within Analyst.

Additional presentations and workshops being offered by AWR and its parent company of National Instruments during EDICON include:

Date & Time

Topic & Presenter

Tuesday, April 8
1:30 pm – 1:50 pm

Effect of Pre-selection and Roofing Filters on Over-the- air Measurements

Tuesday
1:50 pm – 2:10 pm

Addressing the Challenges of Synchronization in Envelope Tracking Test Solutions

Tuesday
2:15 pm – 3:00 pm

Digital Predistortion Techniques for Mobile PA Test

Tuesday
4:15 pm – 5:00 pm

Survey of Wireless Transmitter & Receiver Metrics in Modern Wireless Standards

Wednesday
2:15 pm – 3:00 pm

Implementing Reference Designs in Microwave Office Software

Wednesday
3:30 pm – 4:15 pm

Class F Power Amplifier Design within AWR Microwave Office Software and Featuring Cree

Wednesday
4:15 pm – 5:00 pm

Intrinsic Cree GaN HEMT Models Allow More Accurate Waveform Engineered PA Designs

Wednesday
4:15 pm – 5:00 pm

Increase WLAN Manufacturing Test Throughput with Multi-DUT Test

Thursday
11:20 am – 11:40 am

Analog RF Test Methodology & Architecture for NFC Devices

Thursday
11:20 am – 11:40 am

High-frequency PCB Design and Analysis: Cross-platform Flows/Solutions

Thursday
11:40 am – 12:00 pm

An Integrated Electro-thermal MMIC/RFIC Design Flow

Thursday
11:40 am – 12:00 pm

Comparison of the EMVCo and ISO18047 Power Calibration Method

Thursday
1:30 pm – 2:15 pm

Combining Planar and 3D EM Simulators for RF Interconnect Analysis: Techniques for Better Results

Thursday
2:15 pm – 3:00 pm

EDA Design Flow Panel

Thursday
2:15 pm – 3:00 pm

The Future of Telecommunications Technology Panel

 

Where: 

Booth #301

EDICON 2014 - Beijing International Convention Center

Beijing, China

When: 

April 8, 2014 through April 10, 2014

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