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EDI CON pre-registration numbers exceed previous year

Events

April 2, 2014
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Beijing China,  April 2, 2014 - The Electronic Design Innovation Conference (EDI CON), the industry-driven event for RF, microwave and high speed digital electronic designers to be held April 8-10 at the Beijing International Convention Center is on-track to exceed the attendance numbers of the previous year as Chinese and international guests pre-register for the event in record numbers. Conference delegates will enjoy three days of technical sessions, panels and workshops focused on design, measurement, electronic modeling, simulation and active/passive component use in the development of high-frequency systems used in communications, radar, aerospace and satellite applications.

 The opening day will start promptly at 9:30 in the BICC main auditorium with keynote talks by invited dignitaries from government research, universities and industry. Conference delegates, visitors and exhibitors are invited to this open session which will kick off the event and provide the context for the systems driving the requirements of next-generation high-frequency component design. Following the plenary session, attendees are invited to visit the expanded exhibition halls, which open to registered guests and features solution providers in test & measurement, EDA/CAD software, semiconductors, RFIC/MMICs, active/passive components, cables, connector assemblies and distributors. The technical sessions and workshops will begin in the afternoon at 1:30 pm local time. The commercial vendor exhibition features over 80 organizations. Exhibition attendance is free for registered guests and delegates and will include a networking lounge, press room and scheduled tea/coffee breaks for delegates. The Conference Guide for this three day event is now available online at : http://www.ediconchina.com/conf_program.pdf

Last year’s event drew in excess of 2,000 attendees including over 1,100 unique conference delegates, over 800 visitors and exhibitors and more than 30 members of the press. This year’s event expands the conference to a full three days, adds a fifth technical track and increases the number of papers by over 35% and the number of individual exhibitors by 50%.

"Last year’s EDI CON was a great success, far exceeding our goals for an inaugural event" said David Vye, Conference Director and Editor-in-Chief of Microwave Journal. "Last year we asked sponsors, exhibitors and delegates to believe in our vision for an industry-driven event and to our great satisfaction, the quality of the material was exceptional and the audience engagement with the speakers was exceedingly robust. This year’s offering of technical papers continues this tradition of excellence and we anticipate an engaged exchange between solution providers and the practicing microwave engineer.”

 About EDI CON 2014

EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The integrated technical program and exhibition presents hands-on, practical solutions for enhancing physical design at the semiconductor, module, PCB and system-levels, bringing together designers at the forefront of Chinese innovation and the world's leading technology companies.

For information on the conference program, ongoing updates and major announcements and to register for EDI CON 2014 visit:
www.EDICONCHINA.com.

EDITORIAL CONTACTS:

North America:
David Vye
+1 781 619 1951
Dvye@MWJournal.com
Twitter: @MWJournal

International:
Richard Mumford
+44 207 596 8787
RMumford@MWJournal.com

China:
Katie Huang
+82420876,58607751
katieh@actintl.com.hk

 

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