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Indium Corp.’s Dr. Ning-Cheng Lee, vice president of technology, Dr. Yan Liu, research chemist, Joanna Keck, research technician and Erin Page, research technician, were awarded Honorable Mention for their paper "Voiding and Drop Test Performance of Lead-Free Low-Melting and Medium-Melting Mixed Alloy BGA Assembly" at the opening ceremony of the IPC APEX Expo on March 25.
Their paper reviews data collected while observing the voiding behavior of mixed solder alloy systems under a variety of conditions. Dr. Lee presented this paper at the conference on Tuesday, March 25.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advance materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
Dr. Liu is a Research Chemist in Indium Corp.'s research and development department. Her current research emphasizes solder materials for high-end 3D packaging. Dr. Liu joined Indium Corporation in 2001. She earned her bachelor’s degree in polymer chemistry and a master’s degree in polymer physics from the University of Science and Technology of China, and a PhD in polymer chemistry from the University of Salford Manchester, United Kingdom. She has authored numerous technical papers written for technical publications, and has presented internationally.
Joanna Keck has been with Indium Corp.'s Research and Development Department since 2011. She earned her bachelor’s degree in chemistry in 2010 from Houghton College. She has been supporting Dr. Liu’s research since she joined Indium Corp.
Erin Page is a research technician at Indium Corp.. She earned her bachelor’s degree in biological science from SUNY Oswego in 2012. She has been assisting Dr. Liu’s research since she joined the Research and Development team in 2013.
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