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Industry News

PROCESSING EQUIPMENT

November 1, 1997
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PROCESSING EQUIPMENT

Dicing Saw
This high precision dicing saw utilizes software that displays all dicing parameters simultaneously in an organized fashion for convenient management. The software provides a graphics view of the chuck and wafer (size and location) to illustrate alignment locations and the proposed placement of cuts. New alignment schemes determine wafer center and edge for enhanced production capability. The unit's motion axes are closed-loop controlled, employ Heidenhain high resolution encoders and are built from cast iron slides mounted on a granite base. The full 360° rotatable chuck, 4" Z travel and 3 HP spindle add to the saw's versatility.
Thermocarbon Inc.,
Casselberry, FL (800) 523-1946.

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