This year’s exhibition space is nearly twice as large as 2013 with the addition of a second hall (East Hall) of Chinese and international RF/microwave equipment manufacturers participating. The new East Hall which is accessible through the main entrance of the BICC or through the rear of the West Hall will host semiconductor, components, materials, cable/connector assembly vendors and their distributors. The West hall which is accessed through the Registration entrance will host the test and measurement equipment vendors and EDA/CAD software providers as well as various media and technical societies serving the RF/microwave and high-speed digital industries. The exhibition space provides our delegates and exhibition attendees with an excellent opportunity to experience live product demonstrations and talk to technical experts about their own design challenges. This show guide provides you with a listing of all the participating companies, a summary of their products and services and the on-site staff that is available to consult with you, the design engineer.
Semiconductors – East Hall
GaN and RF CMOS are two very important semiconductor technologies that are transforming next generation RF front-ends. The East Hall features many of the leaders in developing both technologies. Peregrine Semiconductor will be introducing their new reconfigurable RF front-end RFIC devices in booth 512. This technology was big news at Mobile World Congress in February and is making its China debut here at EDI CON. Designers of millimeter-wave GaAs pHEMT RFICs will want to meet the technologists from the OMMIC foundry in booth 508 and Win Semiconductor (booth 509). Speaking of millimeter-wave technology, Millitech (booth 607) is a leading expert in advanced high-performance components for millimeter-wave point-to-point communication systems and test instruments. Their company president will be presenting a talk in the conference and available in their booth to discuss the products available from this technology leader.
Silicon RFIC wafer processing information can be obtained by visiting the experts at MOSIS (booth 602). Information on the latest GaN MMICs, power transistors and amplifiers is available from a number of vendors in the East hall including RFHIC (booth 604), Freescale (booth 502), MACOM (booth 612), NXP (booth 613) and distributors Richardson RFPD (representing TriQuint, Microsemi, MACOM, Freescale) and Sanetronic Co. Ltd. (representing Cree). Mitron and Mini-circuits, a leading global supplier of microwave components, are available to help answer your design questions and recommend the right part for your needs from their vast inventory.
Materials/Cables and Connectors – East Hall
At high frequency, the performance of printed circuit board (PCB) materials and interconnects (cables/connectors) play a critical role on signal integrity and RF performance (insertion loss, phase). Choosing the right material for a given frequency range, performance level, heat-sinking and environmental/mechanical stress requires experience and expertise. The technical folks at Rogers Corp. (518), Park Electrochemical Corp. (716) and Taconic (714) are available in the East hall to help you understand what material properties are required for a given applications. EMC/RF Florida lab (booth 609) manufactures passive components and heatsinking materials as well as cables. Cable selection is also critical for specific applications. Understanding what cable properties best suit single connection applications or repeated connect/disconnect operations, for example, are good questions for the experts at Mitron (booth 513) , JHT (booth 511), and Times Microwave (booth 503).
Circuit, System and EM Simulation – West Hall
EDA/CAD vendors are located in the West hall to help you with your specific design questions and the tools available to help you succeed. EM simulation is critical to modeling the electrical performance of high frequency components. CST (booth 117), ANSYS (booth 117), EMSS (Booth 307) and Sonnet software (booth 401) specialize in planar and 3D EM solvers and will be available to discuss how to model your next RF passive components and electronic packaging or design a better antenna. Agilent Technologies (booth 201) and AWR (booth 301) offer EM simulation fully integrated into their circuit/system simulation and design environment products and offer their RF engineering experts to assist your with your next design challenge as well. As electrical and thermal performance becoming increasingly inter-related due to the high density of today’s devices, exhibition visitors should check out the multi-physics solution from COMSOL in booth 214.
Test equipment and measurement solutions – West Hall
From design verification to production testing, test instruments and systems play a critical role in helping engineers understand and quantify the performance of their products. Making accurate measurements is reliant upon the accuracy of the equipment itself and the engineer who configures the test system and controls the instrument settings. Test equipment vendors in the West hall understand how to apply proper test techniques for accurate RF/microwave and high-speed measurements, automating systems for production or configuring more advanced systems for nonlinear characterization (pulsed systems, load-pull).
For general RF test equipment solutions and advice (network analysis, signal and spectrum analysis, time and mixed- domain analysis) visit Agilent Technologies (booth 201), Rohde and Schwarz (booth 101), National Instruments (booth 301), Anritsu (booth 317), Tektronics (booth 313), Teledyne LeCroy (booth 414) and CETC 41 (booth 223). These vendors also offer solutions for wireless and communication network testing as does Spirent Communications (booth 107), which specializes in over-the-air testing and other advanced test systems for LTE-A. For nonlinear device characterization visit the experts at Focus Microwave (booth 207), Maury Microwave (booth 306), and Auriga Microwave (booth 211). Other notable specialized test vendors include GTS (booth 308) and Microwave Vision Group (booth 410) for anechoic chamber and OTA tests, Signal Core (booth 408) for high precision signal sources, EMSCAN (booth 310) for near-field antenna measurements and PCB and Semiconductors testing from Polar Instruments (booth 311) and IHP (booth 316) respectively.
Networking Lounge – East Hall
Feel free to relax or sit with colleagues and have an ad-hoc meeting in our networking lounge in the rear of the East hall. The networking lounge is opposite the Microwave Journal China and Artech House booths (717 and 715) where you can get your latest copy of Microwave Journal China, sign up for your free subscription or meet our global editorial staff. Artech House is a leading publisher of technical books on microwave and communications technology. Meet their book representatives; learn about new titles that have recently been or are due to be released and look for event related promotions and discounts to some of the industry’s finest technical books.
I hope you reserve plenty of time from your busy EDI CON schedule to spend with the experts in the exhibition hall, many have travelled from around the world to meet design engineers in Beijing and greater China in order to share their knowledge and support your efforts. They are here to answer your questions and help you find the right components, test equipment and software solution to guarantee your success.