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IKE Micro completes in-house air cavity array packaging capability
IKE Micro announces the completion of its in-house air cavity array packaging capability. The line includes automatic 01005/0201 SMT placement, die attach from wafer and waffle pack, wedge wire/ribbon and ball bonding, coil attachment, lid marking, lid attachment and dicing of array assemblies.
“As operating frequencies continue to increase, IKE felt the need to invest in the infrastructure to support the build to print manufacturing needs for US based semiconductor packaging companies. We are providing efficient multi-up packaging solutions for NPI and low/mid volume LGA package orders,” says president and owner, Scott MacKenzie.