- Buyers Guide
EDI CON 2014 opening ceremonies to discuss electronics driving next generation telecommunications and security systems
The Electronic Design Innovation Conference (EDI CON), the industry-driven event for RF, microwave and high speed digital electronic designers to be held April 8-10 at the Beijing International Convention Center will present an opening plenary session emphasizing future communication and aerospace/defense systems made possible through advanced high-frequency ICs. Offering different perspectives from industry, government research and academia, the invited speakers will emphasize investments by the public and private sectors to develop electronics that support future system initiatives such as smart, internet-enabled devices, cities and vehicles, mobile networks with data-rate enhancements up to 1000x, next generation satellite navigation systems and body imaging technology for surveillance security.
The speakers include: Chair Emeritus Professor Dr. Song Junde, Beijing University of Posts and Telecommunications; Dr. Erping Li, Chair Professor and Director of RF and Nanoelectronics Research Center, Zhejiang University; Keming Feng, General Director, Beijing Institute of Radio Metrology and Measurement; Mario Narduzzi, Marketing Manager, Agilent Technologies, (Host Sponsor); Corbett Rowell, R&D Director, China Mobile Research Institute; James Kimery, Director of 5G Development, National Instruments (Corporate Sponsor) and Josef Wolf, Director of Spectrum/NetworkANA and EMC, Rohde & Schwarz (Diamond Sponsor).
Honorary Chair, Dr. Song Junde will welcome delegates to the opening plenary session with a presentation, “China’s Six Major Applications Driving Communications”. As one of China’s leading telecom experts, Professor Song has won numerous awards for national scientific and technological progress in electronics and has been recognized by the National Natural Science Foundation for his science and technology research and international cooperation. Song’s opening keynote speech introduces a survey of six major initiatives defined by the Chinese government and examines how these applications help promote the development of RF/microwave, EMC/EMI, RFID, high-speed digital IC and devices. Examples of indigenous CAD system will be introduced. The speech will also introduce the development of CAD EDA in China and the demand and cultivation of engineering talents on behalf of universities and industry.
The plenary session is scheduled for April 8th, from 9:30 am to 12:00 pm in the main auditorium of the Beijing International Convention Center. Attendance is restricted to registered delegates and qualified visitors to the EDI CON exhibition. The commercial vendor exhibition featuring over 80 organizations will open to delegates and registered exhibition visitors at the close of the plenary session. Exhibition attendance is free. The Conference Guide for this three day event is now available online at : http://www.ediconchina.com/conf_program.pdf