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Industry News

PACKAGING

November 1, 1997
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PACKAGING

High Frequency Alumina/Glass Sidewall Flatpack
This high frequency alumina/glass sidewall flatpack now features two different grounding techniques to achieve higher frequencies. Base-to-seal-ring grounding straps are provided that reduce radiation effects generated at the top cover caused by extraneous coupling. In addition, the packaged base (circuit ground) is grounded to the unused leads within a package, thus greatly reducing coupling and cross talk, and virtually eliminating main line losses and noise.
Mini-Systems Inc., Electronic Package Division,
Plainville, MA (508) 695-2000.

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