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Flip-chip Packaging Significantly Reduces Overall Footprint, Enabling Thinner Solutions for Mobile Platforms
Skyworks Solutions, Inc. (NASDAQ: SWKS), an innovator of high performance analog semiconductors enabling a broad range of end markets today unveiled several wireless networking products incorporating flip-chip packaging, augmenting its existing world-class mobile connectivity portfolio. Skyworks’s newest devices leverage innovative and proprietary manufacturing techniques that allow smartphone and tablet OEMs to incorporate smaller, thinner solutions for 802.11ac system-in-package (SiP) modules. As high-end mobile devices deliver ever-increasing functionality and ubiquitous connectivity, reducing the front-end circuit board footprint is critical as system providers seek high performance, highly flexible solutions for next-generation platforms.
“Skyworks’ unique flip-chip packaging capabilities are enabling us to offer unprecedented form factors in support of flagship smartphones and tablets,” said Bill Vaillancourt, vice president and general manager of mobile connectivity solutions at Skyworks. “Our newest wireless networking devices are highly integrated and solve our customers’ analog and RF complexity challenges so consumers can enjoy mobile platforms with fast, reliable anytime, anywhere data access.”
Flip chip is a type of surface mountable packaging technology that reduces footprint and thickness (compared to conventional packaging), weighs less, is easy to assemble, lowers production costs and improves electrical and thermal performance. Flip-chip solutions combine the strengths of various packaging techniques, such as the size and performance advantage of bare die assembly with the reliability of encapsulated devices which can also be fully RF tested at die level. Their significant size and weight reduction makes them ideal for use in a variety of mobile devices including smartphones and tablets.
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