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What does it take to make it to 80 years in an industry where today’s technology is obsolete tomorrow? For Indium Corp., it takes foresight and dedication.
“Indium Corporation has become known for solving challenges that others haven’t been able to figure out,” said Rick Short, director of marketing communications. “That comes from our curiosity as technologists, and is also a testament to our commitment to achievement.”
Dr. William S. Murray – a man dedicated to investigating the uses of indium metal – founded Indium Corp. in 1934.
Since those early days, Indium Corp. has continued to lead and support the advancement of technologies on which it relies today. With more than 750 employees globally, several company technology experts share their reflections on Indium Corp.’s impact on the past, as well as future goals.
Senior Product Manager for Semiconductor Assembly Materials Dr. Andy C. Mackie said, “Indium Corporation has always been known for its innovations. Most recently, we’ve brought to market bismuth-silver-X (BiAgX™), a technology that finally provides a long awaited lead-free solution for semiconductor die-attach. In addition, Indium Corporation’s no-clean ultra-low residue fluxes, which are designed to be left behind on the surface of the substrate, have allowed semiconductor assemblers to produce reliable low-cost electronics applications.”
Director of Compounds and Solar Products Bill Jackson said, “Indium metal has properties that allow for almost endless uses. We’ve capitalized on this to create custom solutions for some unique manufacturing challenges that no one else has been able to solve. From fire suppression to flat panel displays, Indium Corporation has had, and will continue to have, a significant impact on the way we live.”
Senior Product Manager for Engineered Solders Tim Jensen said, “From Formula One race cars to implantable medical devices, failure is not an option. That’s why it is critical to offer solder solutions that are reliable through a number of conditions. Part of our success as a company is recognizing this need for reliability and producing products – NanoFoil® and other solder solutions – that can stand the rigorous test of end use.“
Product Manager for PCB Assembly Solder Paste Glen Thomas said, “Looking ahead, we’ll definitely see some unique adaptations of technology. Take, for instance, bendable electronics. Indium-tin-oxide already provides the capability to produce devices that can bend and be rolled up.”
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