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Industry News / MMICs&More / Semiconductors / Integrated Circuits

MACOM to showcase highly integrated, plastic-packaged GaN solutions at EDI CON

February 27, 2014
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M/A-COM Technology Solutions Inc.(“MACOM”), a leading supplier of high-performance RF, microwave and millimeter wave products, announced that it will showcase its industry-leading portfolio of new GaN power products at EDI CON 2014 in Beijing, China, April 8-10, 2014. The company will particpate in the event as an exhibitor in Booth #612 and in the conference as a presenter in the peer-reviewed technical session, workshops and special GaN expert panel to be sponsored by Richardson RFPD.

Damian McCann, Director of Engineering for MACOM will present a 20 minute talk in the commercial resources track on "S-band modules and pallets with reduced size and weight for next generation traditional and latest phased array RADAR applications" . In this talk, McCann will discuss how high-voltage GaN semiconductor technology sets a new standard in power, efficiency and bandwidth performance to enable new multi-function RADAR systems, meaningful forward progress on reducing size and weights hinges on our ability to develop and manufacture - smaller, wider bandwidth, lighter and functionally more flexible modules and pallets that promote multifunction integration. McCann will also present a 40 minute workshop entitled, "Breaking the Kilo-watts GaN Boundary" where he will address the design of MACOM's latest high power GaN parts from 500W to 1.5KW, discussing operational boundaries, application and potential usage scenarios and will discuss in more detail the device attributes and what matters in a complete amplifier design including load effects and bias needs.

Mr. McCann will also be a panelist on the Richardson RFPD sponsored GaN Panel to be moderated by Microwave Journal Technical Editor, Pat Hindle and featuring expert from Freescale, Nitronex, Microsemi and TriQuint. The panel will consider topics such as:

Topics to be discussed include:

  • Thermal management and optimization
  • Broadband performance and applications
  • Ruggedness and reliability advantages
  • Packaging requirements
  • Cost drivers and pricing

EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The technical program and exhibition includes the leading international RFIC, component and material manufacturers, semiconductor foundries, EDA software and test equipment/solution providers. This year’s conference features the most recent trends in high-frequency electronics and wireless communication technology, addressing all aspects of design, simulation and test verification through an understanding of system requirements for wireless communication networks such as small cell infrastructure, SATCOM and microwave backhaul.

Visit Stand #612 to meet with experts to see how MACOM can help solve your unique application design challenges.

Learn more about the company's:

  • Highest power GaN in Plastic-packaged power transistors,
  • Integrated GaN power modules for L- and S-frequency bands,
  • Industry-first, highly integrated, plastic-packaged control MMIC for commercial radar applications

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