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Richardson RFPD Inc. announced its sponsorship of the Electronic Design Innovation Conference (EDI CON) 2014 GaN Panel.
EDI CON 2014 will be held from April 8th through 10th at the Beijing International Convention Center in Beijing, China. Richardson RFPD's GaN Panel is scheduled for Wednesday, April 9th, from 1:30 PM to 2:15 PM, local time.
The GaN Panel will be a moderated round table discussion featuring gallium nitride (GaN) experts from Freescale Semiconductor (Freescale), MACOM Technology Solutions (MACOM), Microsemi, Nitronex and TriQuint. Primary topics of discussion will include GaN's attributes for RF applications including wireless, automotive, multimedia and communications, its strengths and weaknesses compared to other technologies, and its outlook for development and adoption in new applications targeting higher frequency greenfield initiatives.
The lineup of expert panelists includes:
Complete profiles of the presenters are available here. The panel will be moderated by Patrick Hindle, Technical Editor of Microwave Journal.
EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The technical program and exhibition includes the leading international RFIC, component and material manufacturers, semiconductor foundries, EDA software and test equipment/solution providers. This year’s conference features the most recent trends in high-frequency electronics and wireless communication technology, addressing all aspects of design, simulation and test verification through an understanding of system requirements for wireless communication networks such as small cell infrastructure, SATCOM and microwave backhaul.
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