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Skyworks Solutions Inc., an innovator of high performance analog semiconductors enabling a broad range of end markets announced that it has unveiled its second-generation SkyOne™ platforms. SkyOne™ is a family of fully optimized, scalable devices that integrate all of the high-performance RF and analog content between the transceiver and antenna into the industry’s smallest footprint. These groundbreaking solutions also provide the world’s best linearity and power added efficiency for smart RF integration. The newest front-end solutions cover more frequency bands, integrate up to seven duplexers, support carrier aggregation and provide standardized inputs for all leading chipsets that are MIPI® RFFE compatible.
“With the introduction of these next generation SkyOne™ platforms, Skyworks is pushing the integration envelope and meeting demands for smartphones, tablets and datacards requiring wider bandwidths being enabled by carrier aggregation,” said Joel King, vice president and general manager of advanced market solutions at Skyworks. “By utilizing our SkyOne™ solutions, mobile device OEMs no longer have to choose between size and time-to-market. These devices deliver best-in-class performance, are highly customizable and scalable as well as compatible with all leading chipsets.”
Skyworks has incorporated breakthrough RF switching technology in its newest devices that are enabling early adopters to implement carrier aggregation solutions. Carrier aggregation allows mobile service providers to combine spectrum and increase data rate throughput by utilizing two or more bands simultaneously instead of the single band method used currently, thereby giving consumers an enriched data experience regardless of location.
Skyworks’ SkyOne™ devices also support standardized inputs to industry leading basebands (MIPI® RFFE compatible) and address both transmit (Tx) and receive (Rx) switching paths. Skyworks’ carrier aggregation switching solutions, which are compliant to tier-one, carrier-driven specifications, are based on silicon-on-insulator wafer process technologies and available in many different configurations.
SkyOne™ is an 8 x 9 x 0.95 millimeter module with up to seven duplexers and a dual-pole, 19 throw antenna switch module (ASM) for models supporting carrier aggregation (CA) and single pole, 16 throw ASMs for models without a CA requirement.
Skyworks will be showcasing its product portfolio in Hall 6, Booth C41 (6C41) at Mobile World Congress being held February 24 – 27.
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