advertisment Advertisement
This ad will close in  seconds. Skip now
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
Industry News

Test equipment and EDA vendors to promote SI, high-speed and EMC/EMI design solutions at EDI CON 2014

February 14, 2014
/ Print / Reprints /
| Share More
/ Text Size+

CST, a leading EM simulation software vendor for high-speed and Signal Integrity analysis and Anritsu,  a leading provider of test instruments for SI and high-speed digital measurements, RF/microwave and wireless test solutions will be among the premier level EDI CON sponsors highlighting SI and high speed solutions in their submitted presentations to the technical conference, workshops and in-booth demos. Both will discuss the challenges of high speed interconnect characterization and the use of frequency based measurement/modeling approaches such as s-parameters in the time domain analyses favored by high-speed designer.  

Other exhibiting companies focusing on high-speed and EMC/EMI characterization and design challenges will include Agilent Technologies (Host Sponsor), Rohde & Schwarz (Diamond Sponsor), National Instruments/AWR (Corporate Sponsor), silver and bronze level sponsors ANSYS (EM software, HFSS and SIWave), COMSOL (EM software),  Sonnet Software (EM planar simulation software), Rogers Corporation (Printed Circuit Board materials for RF and high speed applications), and high speed test instrument providers: Tektronix (China) Co. Ltd., Teledyne LeCroy Inc., NCI Logic Analyzers, Pickering Interfaces, and Polar Instruments (China) Ltd.

About EDI CON 2014 

EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The technical program and exhibition includes the leading international RFIC, component and material manufacturers, semiconductor foundries, EDA software and test equipment/solution providers. This year’s conference features the most recent trends in high-frequency electronics and wireless communication technology, addressing all aspects of design, simulation and test verification through an understanding of system requirements for wireless communication networks such as small cell infrastructure, SATCOM and microwave backhaul.


For information on the conference program, ongoing updates and major announcements and to register for EDI CON 2013 visit:
www.EDICONCHINA.com.

Post a comment to this article

Sign-In

Forgot your password?

No Account? Sign Up!

Get access to premium content and e-newsletters by registering on the web site.  You can also subscribe to Microwave Journal magazine.

Sign-Up

advertisment Advertisement