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Military Microwaves Supplement
Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that Jiro Hashizume recently joined the company to head up its new subsidiary, Hesse Mechatronics Japan Co. Ltd.
Hashizume has 17 years of experience in technical support, software design and sales management in the semiconductor equipment industry. For the past five years he served as territory manager for Japan and Korea for Kulicke & Soffa Industries, Inc. (K&S), where he gained extensive understanding of pre- and post-sales technical support, marketing and sales strategies to grow wire bonding equipment sales. Prior to his time at K&S, Hashizume worked for Orthodyne Electronics as senior field applications engineer and NEC Machinery Corp. as control system engineer.
“Jiro’s extensive experience with wire bonding equipment for the automotive, industrial power and semiconductor device industries provides a solid base for growing our business in Japan,” said Joseph S. Bubel president of Hesse Mechatronics Inc. “Jiro’s sales and marketing expertise combined with his solid wire bonding equipment technical knowledge will greatly benefit our customers and we are thrilled to have him as a member of our Team..”
Bubel will expand his role as president for Hesse Mechatronics’ Americas subsidiary, to also oversee management of the new Japanese subsidiary. Customers may contact Mr. Hashizume by email at email@example.com. The company anticipates opening its new office in Japan later this year.
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