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UBM Tech will welcome thousands to DesignCon 2014 next week
UBM Tech, the daily source of essential business and technical information for decision makers in the electronics industry, will welcome thousands of influential members of the chip, package and board design communities to DesignCon 2014, January 28 – 31, at the Santa Clara Convention Center in Santa Clara, California. Recognized as the premier annual trade event and technical conference dedicated to the pervasive nature of signal integrity at all levels of electronic design, DesignCon will host Keynote Speakers from Intel, Micron Technologies and XPRIZE. DesignCon has also reinforced its commitment to STEM with two new initiatives: a Next-Gen volunteer program geared toward students and emerging engineers and a Bay Area Girl Geek Dinner on Thursday, January 30th.
The DesignCon 2014 Technical Conference will feature more than 100 conference sessions organized under one of 14 tracks designed to address the latest developments in a range of industry-specific categories including: signal and power integrity, PCB design tools and methodologies, parallel and memory interface design, high-speed serial design, wireless and photonic design and integration, and jitter and crosstalk among many others. To help attendees manage their time and priorities and make the most of their show experience, DesignCon is providing an interactive schedule builder that is compatible with the DesignCon Mobile App. Available in iPhone/iPad, Android, and mobile web versions, the DesignCon Mobile App automatically populates with individuals’ online Schedule Builder selections, as well as provides users with an attendee directory, exhibitor listings, location-based check-ins, badging, and Twitter and Facebook interactivity.
With more than 150 exhibitors, the DesignCon 2014 Expo will showcase a wide variety of cutting-edge high-speed design tools, technologies, and solutions for modeling and simulation, test and measurement, prototyping, analyzing, advanced packaging and more.
Preview information about new products to be showcased at the DesignCon 2014 expo is available at the Virtual Press Office and several major new products, including a few from host sponsor Agilent Technologies, are scheduled to be announced at the show. Recent DesignCon Exhibitor Announcements include:
- AtaiTec to Introduce Fixture De-embedding Tool and Signal Integrity Apps
- Rogers Highlights Materials for High Performance Digital and Analog Circuits at DesignCon 2014
- Get a Sneak Peak of Sigrity 16.63 at Cadence Booth #507
- BEST Inc Develops Plastic Film Stencils for DIY'rs, Labs and Educational Institutions
- Pickering Interfaces to Feature RF and Microwave Switching Solutions at DesignCon2014
- Electronics Enhancements In ANSYS 15.0 Bring Increased Fidelity To Users
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Additional DesignCon 2014 expo highlights include: free education, speed training and product teardowns in the Chiphead Theater; the Agilent Education Forum; visionary keynotes from industry leaders at Intel, XPRIZE Foundation, and Micron Technology, Inc.; the DesignVision and Best in Test Awards; happy hour parties with free beer and snacks; and the DesignTOUR expo game, which provides participants with a chance to win one of 14 prizes, including: a $250 gift card, 32GB Kindle Fire HDX, 16GB Google Nexus 10, 40” Samsung Smart TV, and an Xbox One console bundle.
DesignCon is supported by host sponsor Agilent Technologies, Corporate Sponsor Rambus, Diamond Sponsors Anritsu & Teledyne LeCroy, Platinum Sponsor Rohde & Schwarz, and Gold Sponsor Sisoft.
Media and analyst registration is free and you can register now by visiting: https://designcon.tech.ubm.com/2014/registrations/media.