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Industry News

LPKF announces new UV laser depaneling systems for 2014

December 17, 2013
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LPKF Laser & Electronics has announced a new line of UV laser cutting systems for printed circuit board depaneling. Available in early 2014, the MicroLine 2000 Series features a range of systems that meet the rigorous standards of modern circuit depaneling.

The MicroLine 2000 Series benefits from a low-stress UV laser source, which provides two main advantages: the elimination of mechanical stress and the ability to process a wide variety of circuit materials, including flexible, rigid, and rigid-flex substrates.

MicroLine 2000 Series systems will be available in either stand-alone or inline configuration. In addition, systems can be equipped with either a 6 or 12 watt laser source to match user application requirements.

 For more information on the MicroLine 2000 Series, visit LPKF’s website: http://www.lpkfusa.com/microline/2000S.htm.  

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