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MACOM showcasing industry's first highly integrated, plastic-packaged control MMIC for radar applications at IRSI-13

December 10, 2013
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At this year’s International Radar Symposium India 2013 (IRSI-13), M/A-COM Technology Solutions (MACOM) will showcase a broad portfolio of new products for aerospace, defense and network applications. In addition, MACOM executives will be presenting both a plenary talk and an industrial paper presentation during the event, which will take place in Bangalore, December 12-14, 2013.

Speak with MACOM experts to solve your unique application design challenges.

Visit Booth #A4 to learn more about the company’s:

  • Highest power GaN in plastic-packaged power transistors
  • Integrated GaN modules for L- and S-frequency bands
  • Industry’s first highly integrated, plastic-packaged control MMIC for radar applications
  • Broad catalog of 2000+ reliable standard products

Plenary Talk: 

MACOM’s Director of EngineeringDamian McCann will present a paper, “Deploying COTS GaN and SMT Laminate Module Technology to Traditional and Latest Phased Array Radar Applications. ”

Date:     Thursday, December 12

Place:    IRSI-13, NIMHANS Convention Centre, Bangalore – HALL A

Time:     15:00 – 15:30

Industrial Paper Presentation:

Akilan Krishnan, Manager Field Application Engineering, MACOM, India, will present a paper, “Packaged Chipsets for Next Generation X Band Phased Array Radars.”

Date:     Friday, December 13

Place:    IRSI-13 NIMHANS Convention Centre, Bangalore – HALL A

Time:     15:00 – 15:30

Additional Information and Resources:

ISRI-2013 Website: International Radar Symposium India 2013

International Radar Symposium India 2013: http://www.radarindia.com/

For more information about MACOM visit: www.macomtech.com.

  

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