Indium Corp.'s Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore.
Liu’s presentation, An Innovative Composite Solder Preform for TLP Bonding -- Microstructure and Properties of Die-Attach Joints, discusses a special laminate composite preform developed for high temperature Pb-free soldering applications, where a melting temperature of 280°C or higher is required.
Liu has published over 70 research papers in the area of materials joining and processing, and has received several “best paper” awards at international conferences. He received the American Welding Society's Masubuchi Award in 2004 for "an outstanding scientist under the age of 40 who has made significant contributions in the advancement of the science and technology of materials joining through research and development." He was included in the Marquis Who's Who in America and Marquis Who's Who in Science. Liu has a PhD in Materials Science and Engineering from the Harbin Institute of Technology.
EPTC is an International event organized by the IEEE Reliability/CPMT/ED Singapore Chapter and sponsored by IEEE CPMT Society. EPTC 2013 will feature technical sessions, short courses and forums, an exhibition, social and networking activities. It provides coverage of technological developments in all areas of electronics packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.