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Sponsored by Global SMT & Packaging magazine, the award acknowledges outstanding innovations in the printed circuit board assembly and packaging industry. The award was presented to Tim Jensen, Product Manager – PCB Assembly Materials, and Brian Craig, Managing Director – European Operations.
SACM™ is a high-reliability solder alloy that provides the optimal combination of drop test and thermal cycling performance, at a cost which is below that of typical SAC solder alloys. SACM™ is doped with manganese, which impacts the solder grain structure to improve reliability and helps to slow intermetallic growth, reducing the loss of reliability after aging. SACM™ also contains less silver than traditional lead-free alloys. Reduced silver content provides a more stable cost structure, especially for cost-sensitive applications.
SACM™ offers superior drop test performance compared to SAC305 and SAC105, with the added benefit of thermal cycling reliability equivalent to that of SAC305. This development is especially meaningful for the manufacture of consumer electronics that normally see frequent handling and occasional misuse.
SACM™ is manufactured into solder paste using the Indium8.9 Series flux, making it ideal for miniaturized components and fine-pitch assembly. It is specifically designed for CSP, 0201, and 01005 components. Its first-class printing performance provides excellent print transfer through apertures with area ratios of less than 0.66.
Learn more about SACM™ at www.indium.com/SACM.
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