- Buyers Guide
Horizon House Publications and Microwave Journal China announced the lineup of Gold-level sponsors for next year’s Electronic Design Innovation Conference (EDI CON 2014) to be held April 8–10, 2014 at the Beijing International Convention Center in Beijing, China. The Gold sponsors – Anritsu, CST, Spirent Communications, Mini-Circuits and Richardson RFPD – are technology leaders in the areas of RF/microwave and high speed digital test equipment, simulation software, wireless network test solutions, component manufacturing and manufacturer representative/distributor, respectively.
As Gold sponsors, each company will take a leading role in various aspects of the technical program through their participation in educational workshops and industry-focused panel discussions to be named later. The Gold sponsors will also join the other event premier sponsors (Agilent, Rohde & Schwarz and National Instruments/AWR) as major exhibitors in the vendor expo, which will feature hands-on product demos and in-booth experts.
The diversity of technologies among Gold sponsors is well-suited to the broad interests of EDI CON’s target audience. EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The technical program and exhibition includes the leading international RFIC, component and material manufacturers, semiconductor foundries, EDA software and test equipment/solution providers.
This year’s conference features the most recent trends in high-frequency electronics and wireless communication technology, addressing all aspects of design, simulation and test verification through an understanding of system requirements for wireless communication networks such as small cell infrastructure, SATCOM and microwave backhaul. Collectively, the Gold sponsors offer products that address the entire design cycle from simulation to device test and verification, components for system integration and test solutions for mobile devices, wireless networks and infrastructure.