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Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.
Hesse Mechatronics will demonstrate:
For more information on Hesse Mechatronics and its family of wedge bonders, please visit the company’s website at www.hesse-mechatronics.com. For more information on Hesse Mechatronics’ training and applications support services in the Americas and to see wire bonding in action, please visit www.wirebonddemo.com or e-mail email@example.com.
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