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Industry News

Hesse Mechatronics to demonstrate wedge wire bonding capabilities at Productronica

October 30, 2013
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Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.

Hesse Mechatronics will demonstrate:

  • Large diameter copper (Cu) heavy wire capabilityon the Bondjet BJ935 Fully Automatic Heavy Wire Bonder
  • Heavy wire bonder full automation capabilitieson the Bondjet BJ935, featuring the only heavy wire bondhead with non-destructive pull test and a unique transducer integrated sensor for 100% quality monitoring in real-time
  • Lead frame indexingon the Bondjet BJ931High Speed Fully Automatic Dual-Head Wedge Bonder, meeting the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specialized bond heads that can be changed out in minutes
  • The industry standard for thin wire wedge bonding speed and accuracywith the Bondjet BJ820 High Speed Fully Automatic Fine Wire Wedge Bonder, offering speed of up to 7 wires/sec., accuracy of 1 μm at 3 σ axis repeatability, in addition to the largest work area

For more information on Hesse Mechatronics and its family of wedge bonders, please visit the company’s website at www.hesse-mechatronics.com.  For more information on Hesse Mechatronics’ training and applications support services in the Americas and to see wire bonding in action, please visit www.wirebonddemo.com or e-mail info@hesse-mechatronics.us.  

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