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5G and IoT Supplement
W. L. Gore & Associates has introduced a new line of GORE® Spaceflight Microwave/RF Assemblies that have been optimized for Ka-Band uplink and downlink satellite applications. Gore will be featuring the new Type 5G Series assemblies at Space Passive Component Days, September 24-26, 2013, at ESA/ESTEC in Noordwijk, The Netherlands.
The durable construction of the Type 5G Series of GORE Spaceflight Microwave/RF Assemblies provides outstanding shielding effectiveness and ensures reliable signal integrity with excellent insertion loss and return loss performance up to 32 GHz. They have been qualified for spaceflight applications in three separate phases – integration, launch, and in-orbit – to ensure consistently reliable performance for the duration of the mission.
The Type 5G Series of GORE Spaceflight Microwave/RF Assemblies can be terminated with either 2.92 mm straight-pin connectors (ZMQ) or 2.92 mm right-angle pin connectors (ZQA). These robust connectors have been designed to withstand the harsh environment experienced during satellite launch and orbit without compromising signal performance. Additionally, the low-profile of these connectors will increase flexibility during the layout process of satellite design.
Type 5G Series of GORE Spaceflight Microwave/RF Assemblies are available worldwide from manufacturing facilities in the U.S. and Europe.
For more information, visit www.gore.com/aerospace.
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