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Industry News / European Industry News / EuMW2013

MACOM to showcase 1st X-Band core chip, GaN in plastic module and E-Band PAs at EuMW 2013

September 16, 2013
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M/A-COM Technology Solutions (MACOM) will showcase a broad portfolio of new products for aerospace, defense and network applications, and present a technical paper during European Microwave Week in Nuremberg, Germany, October 6-11, 2013. Event attendees can visit MACOM at European Microwave Week in Nuremberg, Germany, October 6-11, 2013, Booth #169.

Speak with our experts to solve your unique application design challenges.

Visit MACOM’s booth to learn more about the:

  • Highest power GaN in Plastic-packaged power transistors
  • Integrated GaN modules for the L- and S- frequency bands
  • Industry’s first X-Band core chipset
  • Lowest power EML driver for 100G optoelectronics applications
  • Linear amplifiers for 13/15/18 GHz cellular backhaul
  • Broad catalog of 2000+ reliable standard products

Exhibition Hours – October 8-10, 2013:

  • Tuesday, October 8, from 9:30 AM – 5:30 PM
  • Wednesday, October 9, from 9:30 AM – 5:30 PM             
  • Thursday, October 10, from 9:30 AM – 4:30 PM

Paper Presentation:  Meeting the need for low cost integrated solutions with E/D PHEMT

Hear expert Henrik Morkner/MACOM present his paper, “A Compact Sub-harmonic Pumped Integrated 18-30GHz Balanced Image Reject Down Converter based on E/D mode PHEMT”

Date:     Monday, October 7

Where:  EuMIC, St. Petersburg Conference Room, NCC Nuremberg, Germany

Time:     9:50AM -10:10 AM

For more information please visit: Speakers at EuMW

For more information about European Microwave Week, please visit: http://www.eumweek.com/

For more information about MACOM visit: www.macomtech.com

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