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AVX Corp., a leading manufacturer of advanced passive components and interconnect solutions, announced its new low-profile 0603 diplexer at the International Microwave Symposium in Seattle, Wash. Based on the company’s patented multilayer organic high density interconnect technology, the new 0603 MLO™ diplexer (part number: DP03B5425TTR) employs high dielectric constant and low loss materials to realize high Q passive printed elements, such as inductors and capacitors in a multilayer stack up. Capable of supporting multiple wireless standards, including: WCDMA, CDMA, WLAN, GSM, and BT, the 0603 diplexers are ideally suited for band switching in dual- and multiband applications, such as WiFi, WiMax, GPS, and cellular bands.
Utilizing land grid array packaging technology, AVX’s new 0603 diplexers have an inherently low profile (0.5mm) and exhibit excellent solderability, low parasitics, and high heat dissipation. Expansion matched to PCBs, the diplexers also provide improved reliability with regards to comparable ceramic or silicon components.
“Our 0805 MLO™ diplexer, released earlier this year, has been well received within the RF industry, so we’re very pleased to be able to release the smaller form factor here at the International Microwave Symposium,” said Larry Eisenberger, senior marketing application engineer at AVX.
AVX’s new 0603 MLO™ diplexer features a maximum power capacity of 4.5W, measures 1.65mm x 0.88mm x 0.42mm (0.065” x 0.035” x 0.017”), is rated for use in temperatures ranging from -40°C to +85°C, and is available in Ni Au, Ni Sn, and OSP finishes, all of which are compatible with automatic soldering technologies. Finished parts are 100% tested for electrical parameters and visual characteristics and are packaged on tape and reel.
Visitors to the International Microwave Symposium exhibition, June 4th – 6th, can learn more about AVX’s new 0603 MLO™ diplexer and its full catalogue of passive components for RF and microwave applications at the AVX booth, #1927.
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